Sairam Agraharam
Intel Fellow and Director of Advanced 2.5D/3D packaging Pathfinding
About
Sairam Agraharam currently serves as Intel Fellow and Director of Advanced 2.5D/3D packaging Pathfinding at Intel Corporation in Greater Phoenix Area. With a focused background in Semiconductors, Sairam Agraharam leads strategic organizational growth and executive operations for Intel Corporation.
Work History
Intel Fellow and Director of Advanced 2.5D/3D packaging Pathfinding
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